Rapidus has recently expanded its partnership with IBM to include chiplet packaging, as reported by eeNews Europe. This agreement will enhance their efforts in developing advanced packaging solutions for a wide range of applications. Rapidus will leverage IBM’s expertise in chiplet technology to further improve the performance and efficiency of their products. This collaboration signifies … Read more
IBM and Fast have recently announced a partnership to jointly develop cutting-edge chiplet packages. This collaboration aims to establish mass production technologies for high-performance semiconductors, with Rapidus benefiting from IBM’s advanced packaging technology. The two companies will work together to drive innovation in this area. The agreement is part of a larger international project led … Read more
IBM has introduced its Power-powered cloud to on-premises environments with the launch of IBM Power Virtual Server Private Cloud. This service, announced quietly on Tuesday, allows IBM Power Systems customers to expand their Power IT resources off-premises without the need for software adjustments or new licenses. The Power Virtual Server Private Cloud replicates Power machines … Read more
In a recent report from Taiwan, it was revealed that NVIDIA is taking steps to optimize the supply chain for their latest AI chips. The report suggests that NVIDIA’s Blackwell GPUs, known for their high performance in AI applications, may start using panel-level fan-out packaging for their GB200 GPU earlier than anticipated in 2025. The … Read more
Johnson & Johnson, Bank of America, and Goldman Sachs are scheduled to report third-quarter earnings on Tuesday, Ericsson slumps after withdrawing margin guidance, and NetScout reduces its outlook for fiscal 2024. Source link