IBM and Deca boost North American chipmaking with new advanced packaging line in Quebec
According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive…
Tag: Packaging
International Business Machines (NYSE:IBM) Partners With Deca For Advanced Chiplet Packaging Expansion
International Business Machines (NYSE:IBM) experienced a price move of approximately 12% over the last month, coinciding with several significant corporate…
![[News] NVIDIA Reaffirms TSMC as Preferred U.S. Advanced Packaging Partner, Reportedly Sidelines Intel | TrendForce News](https://i1.wp.com/img.trendforce.com/blog/wp-content/uploads/2025/03/20102249/nvidia-ceo-jensen-huang-delivers-gtc-keynote_1a0af921-7eed-4c0a-9e31-c164d0cd5387-prv-624x351.jpg?ssl=1 "[News] NVIDIA Reaffirms TSMC as Preferred U.S. Advanced Packaging Partner, Reportedly Sidelines Intel | TrendForce News")
[News] NVIDIA Reaffirms TSMC as Preferred U.S. Advanced Packaging Partner, Reportedly Sidelines Intel | TrendForce News
During the international press conference for Computex 2025, NVIDIA CEO Jensen Huang, when asked whether NVIDIA might use Samsung or Intel for advanced……
Siemens and Intel expand collaboration on IC and packaging solutions
Siemens’ Calibre platform is now certified for Intel’s 18A production Process Design Kit (PDK), which features RibbonFET transistors and PowerVia…
Intel ups the advanced packaging ante with EMIB-T – EDN – Voice of the Engineer
Intel ups the advanced packaging ante with EMIB-T EDN – Voice of the Engineer Article Source https://www.edn.com/intel-ups-the-advanced-packaging-ante-with-emib-t/
Lip-Bu Tan’s Intel: leaner, flatter, and betting big on packaging
Lip-Bu Tan’s Intel: leaner, flatter, and betting big on packaging digitimes Article Source https://www.digitimes.com/news/a20250505PD216/intel-lip-bu-tan-intel-foundry-packaging-2025.html
What’s advanced packaging? It’s a big way Intel Foundry hopes to dazzle – Fierce Electronics
What’s advanced packaging? It’s a big way Intel Foundry hopes to dazzle Fierce Electronics Article Source https://www.fierceelectronics.com/electronics/whats-advanced-packaging-its-big-way-intel-foundry-hopes-dazzle
Intel’s Nova Lake “X3D-Like” CPUs Are Now Very Much a Possibility; Could Potentially Feature Intel’s 18A-PT Process With Foveros Direct 3D Packaging
The PC consumer market has been demanding an “AMD’s X3D” like implementation from Intel, and it could very well be…
Synopsys Powers Advanced Packaging for AI and HPC Designs on Intel 18A – HPCwire
Synopsys Powers Advanced Packaging for AI and HPC Designs on Intel 18A HPCwire Article Source https://www.hpcwire.com/off-the-wire/synopsys-powers-advanced-packaging-for-ai-and-hpc-designs-on-intel-18a/
Intel shares new details about upcoming Intel 14A process, packaging technologies – SiliconANGLE
Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s…