As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company’s chief executive Jensen Huang confirmed at a press conference in…
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https://www.tomshardware.com/tech-industry/nvidia-shifts-to-cowos-l-packaging-for-blackwell-gpu-production-ramp-up


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