Nvidia Supplier TSMC To Double Advanced Chip Packaging Capacity As AI Demand From Microsoft, Amazon Soars – Alphabet (NASDAQ:GOOG), Amazon.com (NASDAQ:AMZN)

Taiwan Semiconductor Mfg. Co. Ltd. TSM is set to double its production capacity for advanced packaging, a move driven by the increasing demand for artificial intelligence chips from major players like Nvidia Corp. NVDA, Microsoft Corp MSFT,…