Broadcom-TOPPAN JV Opens Singapore FC-BGA Substrate Facility for AI Chip Production – EE Times Asia
By Stephen Las Marias Publication Date: 2026-10-21 02:19:00 Advanced Substrate Technologies (AST), a joint venture between TOPPAN Holdings Inc. and…
Tag: BroadcomTOPPAN
Broadcom-Toppan venture opens Singapore’s first high-end FC-BGA substrate plant
By Jingyue Hsiao, DIGITIMES, Taipei Publication Date: 2026-09-30 00:43:00 Advanced Substrate Technologies (AST), a joint venture between Japan’s Toppan Holdings…
Broadcom-Toppan JV opens “first” substrate plant in Singapore
By Shubhendu Vimal Publication Date: 2026-09-29 13:41:00 The facility will make large-body, high-layer-count FC-BGA substrates for advanced semiconductor products. Credit:…
Broadcom-TOPPAN JV AST Completes Substrate Facility in Singapore
By MT Newswires Publication Date: 2026-09-29 05:23:00 Delayed 02:30:00 2026-09-29 am EDT 5-day change 1st Jan Change 2,339.50 JPY …