Broadcom-Toppan venture opens Singapore’s first high-end FC-BGA substrate plant

Broadcom-Toppan venture opens Singapore’s first high-end FC-BGA substrate plant

By Jingyue Hsiao, DIGITIMES, Taipei
Publication Date: 2026-09-30 00:43:00

Advanced Substrate Technologies (AST), a joint venture between Japan’s Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026, the first in the country capable of producing high-end flip chip ball grid…