Broadcom-Toppan JV opens “first” substrate plant in Singapore

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Broadcom-Toppan JV opens “first” substrate plant in Singapore

By Shubhendu Vimal
Publication Date: 2026-09-29 13:41:00

The facility will make large-body, high-layer-count FC-BGA substrates for advanced semiconductor products. Credit: Sundry Photography / Shutterstock.com

Advanced Substrate Technologies (AST), a joint venture between US chipmaker Broadcom and Japan’s Toppan Holdings, has opened a substrate manufacturing plant in Singapore.

The company says the facility is the first in the country capable of producing high-end flip chip ball grid array (FC-BGA) substrates.

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