Rapidus has recently expanded its partnership with IBM to include chiplet packaging, as reported by eeNews Europe. This agreement will enhance their efforts in developing advanced packaging solutions for a wide range of applications. Rapidus will leverage IBM’s expertise in chiplet technology to further improve the performance and efficiency of their products. This collaboration signifies a significant step forward for both companies in the semiconductor industry.
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https://www.eenewseurope.com/en/rapidus-expands-ibm-deal-to-cover-chiplet-packaging/
Rapidus broadens partnership with IBM to include chiplet packaging
