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IBM

Rapidus and IBM Strengthen Partnership in Chiplet Packaging Technology for 2nm-Generation Semiconductors

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Rapidus Corporation, a manufacturer of advanced logic semiconductors, and IBM have announced a joint development partnership to work on chiplet packages. This collaboration...
IBM

IBM partners with Rapidus to enhance chiplet packaging

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Tech giant IBM and Japanese semiconductor manufacturer Rapidus have joined forces to advance mass production technologies for chiplet packages. This collaboration focuses on...
IBM

Rapidus partners with IBM to collaborate on chiplet packaging

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Rapidus has partnered with IBM to utilize their packaging technology for high-performance semiconductors. The collaboration aims to facilitate further innovation in the semiconductor...
IBM

Rapidus broadens partnership with IBM to include chiplet packaging

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Rapidus has recently expanded its partnership with IBM to include chiplet packaging, as reported by eeNews Europe. This agreement will enhance their efforts...
IBM

Rapidus and IBM strengthen partnership in chiplet packaging technology – TipRanks.com

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IBM and Fast have recently announced a partnership to jointly develop cutting-edge chiplet packages. This collaboration aims to establish mass production technologies for...

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