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Tag: Packaging

Apple and NVIDIA To Turn Into Direct Rivals Over TSMC’s Crucial Chip Packaging
Nvidia

Apple and NVIDIA To Turn Into Direct Rivals Over TSMC’s Crucial Chip Packaging

vm_adminJanuary 9, 2026

By Rohail Saleem Publication Date: 2026-01-08 20:36:00 Up until recently, Apple and NVIDIA maintained neat and clearly delineated orbits within…

NVIDIA and AMD Explore Intel 14A Node, Apple and Broadcom Considering Intel EMIB Packaging
Broadcom

NVIDIA and AMD Explore Intel 14A Node, Apple and Broadcom Considering Intel EMIB Packaging

vm_adminDecember 19, 2025

By TechPowerUp Publication Date: 2025-12-18 17:09:00 NVIDIA and AMD are reportedly evaluating Intel Foundry’s 14A node, while Apple and Broadcom…

NVIDIA and AMD Explore Intel 14A Node, Apple and Broadcom Considering Intel EMIB Packaging
Nvidia

NVIDIA and AMD Explore Intel 14A Node, Apple and Broadcom Come After Intel EMIB Packaging

vm_adminDecember 18, 2025

By TechPowerUp Publication Date: 2025-12-18 17:09:00 NVIDIA and AMD are reportedly evaluating Intel Foundry’s 14A node, while Apple and Broadcom…

Intel’s AI Strategy Will Favor a “Broadcom-Like” ASIC Model Over the Training Hype, Offering Customers Foundry & Packaging Services
Broadcom

Intel’s AI Strategy Will Favor a “Broadcom-Like” ASIC Model Over the Training Hype, Offering Customers Foundry & Packaging Services

vm_adminDecember 13, 2025

By Muhammad Zuhair Publication Date: 2025-12-12 20:36:00 Intel’s AI plans have been under uncertainity for several quarters now, but it…

NVIDIA Alone Has TSMC’s Advanced Packaging Lines Booked for Several Years Ahead, Leaving Little Room for Competitors
Nvidia

NVIDIA Alone Has TSMC’s Advanced Packaging Lines Booked for Several Years Ahead, Leaving Little Room for Competitors

vm_adminDecember 10, 2025

By Muhammad Zuhair Publication Date: 2025-12-10 08:09:00 Advanced packaging is becoming one of the biggest constraints for the AI industry,…

Canada invests 0 million in IBM Bromont and C2MI to boost semiconductor packaging capacity
IBM

Canada invests $210 million in IBM Bromont and C2MI to boost semiconductor packaging capacity

vm_adminNovember 28, 2025

By Arundhati Sarkar Publication Date: 2025-11-28 15:05:00 Vertigo3d/iStock via Getty Images Canada is investing up to $210 million through the…

Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel’s EMIB and 2.5D memory packaging tech
Broadcom

Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel’s EMIB and 2.5D memory packaging tech

vm_adminNovember 18, 2025

By Aaron Klotz Publication Date: 2025-11-18 15:47:00 A few months ago, we reported that Intel and Apple were reportedly in…

Apple, Broadcom, and Qualcomm May Tap Intel Advanced Packaging
Broadcom

Apple, Broadcom, and Qualcomm May Tap Intel Advanced Packaging

vm_adminNovember 18, 2025

By TechPowerUp Publication Date: 2025-11-18 12:14:00 Apple, Broadcom, and Qualcomm might soon become customers of Intel Foundry, but not for…

Nestlé and IBM leverage AI and deep tech for packaging
IBM

Nestlé and IBM leverage AI and deep tech for packaging

vm_adminJuly 8, 2025

Are you a client? Sign in to view the full news archive. Nestlé R&D and IBM Research are working together…

Nestlé and IBM’s AI tool proposes ‘entirely new’ packaging materials
IBM

Nestlé and IBM’s AI tool proposes ‘entirely new’ packaging materials

vm_adminJuly 7, 2025

Nestlé’s R&D team has collaborated with IBM Research to develop new AI tools, including one said to be capable of…

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