Packaging

Nvidia Supplier TSMC To Double Advanced Chip Packaging Capacity As AI Demand From Microsoft, Amazon Soars – Alphabet (NASDAQ:GOOG), Amazon.com (NASDAQ:AMZN)

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Nvidia Supplier TSMC To Double Advanced Chip Packaging Capacity As AI Demand From Microsoft, Amazon Soars – Alphabet (NASDAQ:GOOG), Amazon.com (NASDAQ:AMZN)

Taiwan Semiconductor Mfg. Co. Ltd. TSM is set to double its production capacity for advanced packaging, a move driven by the increasing demand for artificial intelligence chips from major players like Nvidia Corp. NVDA, Microsoft Corp MSFT,… Article Source https://www.benzinga.com/markets/equities/24/11/41706702/nvidia-supplier-tsmc-to-double-advanced-chip-packaging-capacity-as-ai-demand-from-microsoft-amaz

Competition between Japan and South Korea intensifies as they rush to develop GCS for next-gen chip packaging while Intel advances

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Competition between Japan and South Korea intensifies as they rush to develop GCS for next-gen chip packaging while Intel advances

Glass core substrates (GCS) are expected to be essential in the advanced packaging of upcoming chip technologies. Companies in the semiconductor supply chain in Japan and South Korea are increasing their focus on developing GCS solutions or acquiring relevant companies to stay competitive in the market. Semiconductor players in both Japan and South Korea are … Read more

Market Intelligence on the Beverage Alcohol Packaging Trends

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Journalist’s Rewrite: Sign up for the complimentary weekly newsletter to stay updated on the latest news in the global alcohol industry. Gain valuable insights from in-depth category and market analysis supported by industry benchmark data, as well as interviews with industry leaders that provide valuable insights into your competitors. Rest assured, there will be zero … Read more

EDA tools enablement enhances Intel’s EMIB packaging technology – EDN

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Intel is enhancing its Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology by partnering with EDA tools. This collaboration aims to provide a more efficient and reliable solution for integrating multiple types of chips into a single package. The EMIB technology allows for the stacking of multiple chips in a single package, enabling better performance and … Read more

The industry-standard design and test tools now support Intel’s EMIB packaging tech

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The industry-standard design and test tools now support Intel’s EMIB packaging tech

Intel’s EMIB packaging technology is being increasingly adopted by Intel Foundry customers, with support from third-party EDA tools. Companies like Ansys, Cadence, Siemens, and Synopsys now offer software that supports EMIB chiplet-to-chiplet interconnects for AI and HPC processors. EMIB technology allows for the integration of multi-chip designs into a single package using a silicon bridge … Read more

[News] TSMC, Samsung, and Intel Enter New Battleground in Panel-Level Packaging | TrendForce Insights

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[News] TSMC, Samsung, and Intel Enter New Battleground in Panel-Level Packaging | TrendForce Insights

The semiconductor industry is witnessing a shift towards panel-level packaging, with TSMC, Intel, and Samsung investing in this technology. TSMC, a prominent wafer foundry, is exploring panel-level packaging to accommodate more chipsets on a single rectangular substrate, replacing the traditional circular wafer. This move is driven by the anticipated increase in demand for AI technologies … Read more

Intel Foundry ecosystem partners incorporate reference flows for advanced packaging technology EMIB

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Intel Foundry ecosystem partners incorporate reference flows for advanced packaging technology EMIB

Intel’s foundry ecosystem partners have recently introduced reference flows for advanced EMIB (Embedded Multi-die Interconnect Bridge) packaging. This technology allows for the integration of multiple chips on a single package, enabling enhanced performance and power efficiency in electronic devices. EMIB packaging is a key innovation in the semiconductor industry as it enables different types of … Read more

Rapidus and IBM Strengthen Partnership in Chiplet Packaging Technology for 2nm-Generation Semiconductors

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Rapidus and IBM Strengthen Partnership in Chiplet Packaging Technology for 2nm-Generation Semiconductors

Rapidus Corporation, a manufacturer of advanced logic semiconductors, and IBM have announced a joint development partnership to work on chiplet packages. This collaboration aims to establish mass production technologies for chiplet packages, with Rapidus receiving IBM packaging technology for high-performance semiconductors. The two companies will work together to innovate in this space, continuing their existing … Read more

IBM partners with Rapidus to enhance chiplet packaging

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IBM partners with Rapidus to enhance chiplet packaging

Tech giant IBM and Japanese semiconductor manufacturer Rapidus have joined forces to advance mass production technologies for chiplet packages. This collaboration focuses on the development of 2nm generation semiconductors as part of the Japan New Energy and Industrial Technology Development Organization’s project. Rapidus will leverage IBM’s packaging technology to enhance high-performance semiconductors. The partnership will … Read more

Rapidus partners with IBM to collaborate on chiplet packaging

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Rapidus partners with IBM to collaborate on chiplet packaging

Rapidus has partnered with IBM to utilize their packaging technology for high-performance semiconductors. The collaboration aims to facilitate further innovation in the semiconductor industry. Rapidus CEO Atsuyoshi Koike expressed enthusiasm about the international partnership and highlighted the potential for Japan to enhance its presence in the semiconductor packaging supply chain. This collaboration is part of … Read more