JetCool, Broadcom partner on liquid cooling for AI chips

JetCool, Broadcom partner on liquid cooling for AI chips

By Sherri Wang, DIGITIMES Asia, Taipei
Publication Date: 2026-03-12 09:44:00

JetCool, a subsidiary of Flex, has partnered with Broadcom to develop liquid cooling solutions for next-generation AI processors, according to a press release issued March 11. The collaboration aims to address rising thermal demands as AI chip power densities continue to increase.