Japan TOPPAN, US Broadcom JV open chip fab Singapore

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Japan TOPPAN, US Broadcom JV open chip fab Singapore

By Duc Dao
Publication Date: 2026-09-30 08:31:00

A joint venture between Japan’s TOPPAN and U.S. chipmaker Broadcom opened Singapore’s first plant for high-end FC-BGA chip substrates on Tuesday, a component in short supply as demand for AI processors surges.

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