Japan TOPPAN, US Broadcom JV open chip fab Singapore
By Duc Dao Publication Date: 2026-09-30 08:31:00 A joint venture between Japan’s TOPPAN and U.S. chipmaker Broadcom opened Singapore’s first…
Tag: Toppan
Broadcom, Toppan open Singapore’s first advanced chip substrate facility
By CHENG TING-FANG Publication Date: 2026-09-29 04:15:00 Technology US and Japanese pair aim to ease supply bottleneck hampering AI boom…