Tech giant IBM and Japanese semiconductor manufacturer Rapidus have joined forces to advance mass production technologies for chiplet packages. This collaboration focuses on the development of 2nm generation semiconductors as part of the Japan New Energy and Industrial Technology Development Organization’s project.
Rapidus will leverage IBM’s packaging technology to enhance high-performance semiconductors. The partnership will involve R&D and manufacturing activities at IBM’s North American facilities, where engineers from both companies will work on semiconductor packaging for high-performance computing systems. IBM brings its expertise in R&D and manufacturing technologies for semiconductor packaging to the table, having previously collaborated with Japanese semiconductor manufacturers.
The goal of the collaboration is to help Rapidus establish advanced chip packaging technology. IBM’s senior vice president and research director, Darío Gil, expressed excitement about expanding the collaboration with Rapidus to develop next-generation chiplet technology. He highlighted their commitment to supporting the development of advanced node production processes, design, and packaging, as well as exploring new use cases and supporting the semiconductor workforce.
Similarly, Rapidus President and CEO Atsuyoshi Koike emphasized the significance of the partnership with IBM in establishing 2nm semiconductor packaging technology. He mentioned leveraging international collaboration to enhance Japan’s role in the semiconductor packaging supply chain.
In addition to this partnership, IBM announced its intention to acquire HashiCorp in April 2024 for $6.4 billion to expand its cloud software offering. HashiCorp, a US-based company, provides tools for businesses to build and manage cloud infrastructures.
Overall, the collaboration between IBM and Rapidus aims to drive innovation and technological advancements in semiconductor packaging, particularly focusing on the development of 2nm generation semiconductors. This strategic partnership between the tech giant and the Japanese semiconductor manufacturer underscores the importance of international collaboration in advancing semiconductor technologies and positioning Japan as a key player in the global semiconductor industry.
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https://www.verdict.co.uk/news/ibm-rapidus-chiplet-packaging-partnership/