Cisco Silicon One combines uniform chip design with specific deployments

Cisco Silicon One combines uniform chip design with specific deployments

By Sander Almekinders
Publication Date: 2026-03-20 13:00:00

Cisco recently announced the Silicon One G300, a 102.4 terabit networking chip that represents one of the most advanced switching solutions available for AI data center infrastructure. During Cisco Live EMEA, we had the chance to dive a bit deeper into this new development and what it means for the industry with Martin Lund, Executive Vice President of Cisco’s Common Hardware Group. We didn’t only talk about how Cisco built this enormous piece of silicon, but spent a good amount of time talking about what’s next too, including silicon photonics.

The G300 is the latest addition to the Silicon One portfolio. It’s a 3-nanometer chip built by TSMC that delivers a lot of networking capacity for connecting large-scale GPU clusters. With the G300, Cisco joins an exclusive group of only three companies worldwide capable of producing networking silicon at this performance level, alongside Nvidia and Broadcom, according to Lund.