By Business Wire
Publication Date: 2026-04-22 19:00:00
The expanded partnership enables Cadence’s Design for AI and AI for Design strategy across TSMC’s N3, N2, A16 and A14 process nodes
Developing “agent-ready” digital and analog operations that integrate agentic AI to enable targeted PPA, reliability and productivity optimization.
Cadence’s TSMC-certified digital, custom/analog 3D IC and signoff platforms reduce design iterations and time to tapeout.
The strong customer momentum in developing TSMC’s 3nm and 2nm technologies underscores the broad market impact of the collaboration.
SAN JOSE, Calif., April 22, 2026–(BUSINESS WIRE)–Cadence (Nasdaq: CDNS) today announced an expansion of its long-standing relationship with TSMC to accelerate AI-driven semiconductor innovation. The expanded collaboration will deliver IP, sign-off-ready end-to-end design infrastructure and advanced, certified operations for cutting-edge AI silicon on TSMC’s N3, N2, A16™ and A14 process technologies. The companies…
