QuickLogic joins Intel Foundry Chiplet Alliance – Engineering.com
QuickLogic joins Intel Foundry Chiplet Alliance Engineering.com Article Source https://www.engineering.com/quicklogic-joins-intel-foundry-chiplet-alliance/
Tag: chiplet
QuickLogic joins Intel Foundry Chiplet Alliance – Investing.com
QuickLogic joins Intel Foundry Chiplet Alliance Investing.com Article Source https://www.investing.com/news/company-news/quicklogic-joins-intel-foundry-chiplet-alliance-93CH-4088521
QuickLogic Joins Intel Foundry Chiplet Alliance | QUIK Stock New
QuickLogic (QUIK, Financial) joins Intel Foundry Chiplet Alliance, gaining early access to advanced technologies. The partnership enables QuickLogic’s participation in…
Intel Foundry Alliance Taps QuickLogic for Critical Defense and Commercial Chiplet Development
Collaboration gives QuickLogic early access to Intel Foundry’s advanced process and packaging roadmaps and strengthens its strategy to deliver secure,…
QuickLogic Joins Intel Foundry Chiplet Alliance
Collaboration gives QuickLogic early access to Intel Foundry’s advanced process and packaging roadmaps and strengthens its strategy to deliver secure,…
International Business Machines (NYSE:IBM) Partners With Deca For Advanced Chiplet Packaging Expansion
International Business Machines (NYSE:IBM) experienced a price move of approximately 12% over the last month, coinciding with several significant corporate…
HPC News Bytes 20250520: Computex Commences, Intel 18A Fab Panther Lake, the US and HPC Leadership, a New Chiplet Alliance – insideHPC
HPC News Bytes 20250520: Computex Commences, Intel 18A Fab Panther Lake, the US and HPC Leadership, a New Chiplet Alliance insideHPC…
Floorplanning Method Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
A new technical paper titled “STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers…
Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)
A new technical paper titled “DiffChip: Thermally Aware Chip Placement with Automatic Differentiation” was published by researchers at MIT and…
ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility – All About Circuits
ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility All About Circuits Article Source https://www.allaboutcircuits.com/news/isscc-2025-intel-propels-chiplet-interconnect-speed-and-flexibility/