By www.ETTelecom.com
Publication Date: 2026-04-20 02:28:00
SEOUL: SK Hynix said on Monday it is set to begin mass production of Small Outline Compression Attached Memory Module 2 (SOCAMM2) designed for use with Nvidia‘s Vera Rubin chips.
SOCAMM2 is a module that adapts low-power memory, which was previously used mainly in mobile products like smartphones, for server environments. It is designed to be a primary memory solution for next-generation artificial intelligence servers.