Google Pixel 9a: Leak reveals camera details and hints at downgrades for thinner camera module – Notebookcheck.net

Google Pixel 9a: Leak reveals camera details and hints at downgrades for thinner camera module  Notebookcheck.net Article Source https://www.notebookcheck.net/Google-Pixel-9a-Leak-reveals-camera-details-and-hints-at-downgrades-for-thinner-camera-module.906034.0.html

Azure Maps Web SDK Map Control version 2.0.x and Azure Maps Service Module will be retired on 30 September 2026 | Azure updates | Microsoft Azure

Azure Maps Web SDK Map Control version 2.0.x and Azure Maps Service Module will be retired on 30 September 2026 | Azure updates | Microsoft Azure

Azure Maps Web SDK Map Control version 2.0.x and Azure Maps Service Module will be retired on 30 September 2026. Please transition to Azure Maps Web SDK Map Control version 3 if you’re on Azure Maps Web SDK control… Article Source https://azure.microsoft.com/en-us/updates/azure-maps-web-sdk-map-control-version-20x-and-azure-maps-service-module-will-be-retired-on-30-september-2026/

DFI Introduces New COM Express Mini Type 10 Module Featuring Intel Atom® x7000RE Series Processors – PR Newswire APAC – PR Newswire Asia

DFI has introduced a new COM Express Mini Type 10 module that features Intel Atom x7000RE series processors. This new module is designed to be compact and efficient, making it suitable for a variety of industrial applications. The Intel Atom x7000RE series processors offer improved performance and efficiency compared to previous models, making them ideal … Read more

Research Study on Co-Packaged Optics Module (CPO) Industry Featuring Broadcom, Intel, and Ranovus – Economica

Research Study on Co-Packaged Optics Module (CPO) Industry Featuring Broadcom, Intel, and Ranovus – Economica

The global co-packaged optical modules (CPO) market report offers insights into past sales figures and forecasts for 2024 to 2031. The report uses a combination of primary and secondary research methods to analyze the market landscape. The impact of COVID-19 on the market, regional performance, and market segmentation by type and application are discussed in … Read more

Introducing AAEON’s NanoCOM-RAP: 13th Gen Intel COM Express Type 10 Module for Embedded Computing

Introducing AAEON’s NanoCOM-RAP: 13th Gen Intel COM Express Type 10 Module for Embedded Computing

In a recent article by Chad Cox for Embedded Computing Design, AAEON introduced its NanoCOM-RAP, a COM Express Type 10 CPU module powered by 13th Generation Intel Core processors. The NanoCOM-RAP supports up to 10 cores, 12 threads, and turbo frequency on its performance and efficiency cores. This new module is designed to meet the … Read more