By Ovais Subhani
Publication Date: 2026-09-29 07:15:00
SINGAPORE – Singapore is expanding its foothold in the global semiconductor supply chain with the opening of its first plant producing advanced substrates used in AI and networking applications.
Officially opened on Sept 29, the 95,000 sq m Advanced Substrate Technologies (AST) facility in Jurong Lake District will produce Flip Chip Ball Grid Array (FC-BGA) substrates.
FC-BGA substrates are components that provide high-density connections between semiconductor chips and circuit boards, allowing for higher data speeds and better signal integrity.
AST is a joint venture between Japan’s Toppan Holdings and US chip-design firm Broadcom.
Toppan did not disclose the capital investment in the plant, but Japanese media in 2024 put the figure at about 50 billion yen (S$405 million), with future expansion expected to push the total beyond 100 billion yen.
The facility also houses research and development capabilities to meet future performance demands, alongside close collaborations with…
