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Siemens and Intel expand collaboration on IC and packaging solutions

Siemens and Intel expand collaboration on IC and packaging solutions

Siemens’ Calibre platform is now certified for Intel’s 18A production Process Design Kit (PDK), which features RibbonFET transistors and PowerVia backside power delivery. This enables mutual customers to use Calibre as a sign-off verification…

Article Source
https://evertiq.com/design/2025-05-07-siemens-and-intel-expand-collaboration-on-ic-and-packaging-solutions

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