By TechPowerUp
Publication Date: 2026-01-28 10:09:00
The “Feynman” AI GPU will still be majorly TSMC-based, with its core IP being built on die(s) leveraging TSMC A16 (1.6 nm) foundry node, which is expected to make up 75% of the chip’s value. The remaining silicon content will be built on Intel 18A or Intel 14A nodes, and the chip’s final packaging is expected to take place in U.S. soil, at Intel Foundry. This way, it will be Intel handling the EMIB chiplet bonding. “Feynman” is expected to implement a newer memory standard, such as HBM4e or even HBM5, and significantly increase memory per package, so each chip can handle trillion-parameter scale models.