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Over the past few days, the proverbial waters have become quite murky due to the lack of visibility over TSMC’s supposed travails related to its bespoke wafer-level system integration platform, CoWoS. Now, however, analysts at Morgan Stanley have stepped up to offer some much-needed clarity on this topic and its…

![Morgan Stanley: “[TSMC’s] Customers Like AMD And Broadcom Are Releasing CoWoS-S Capacity Due To Weaker Demand,” Allowing NVIDIA To “Convert This Capacity To CoWoS-L For GB300A Production” Morgan Stanley: “[TSMC’s] Customers Like AMD And Broadcom Are Releasing CoWoS-S Capacity Due To Weaker Demand,” Allowing NVIDIA To “Convert This Capacity To CoWoS-L For GB300A Production”](https://i3.wp.com/cdn.wccftech.com/wp-content/uploads/2025/01/NVIDIA-TSMC-CoWoS.jpeg?resize=783,392&ssl=1)


