By PR Newswire
Publication Date: 2026-03-11 13:05:00
AUSTIN, Texas, March 11, 2026 /PRNewswire/ — JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex’s global mass production capabilities.
As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment timelines. Through this collaboration, JetCool has developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom’s mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm² per device.
By aligning silicon design, advanced packaging, mechanical integration, and thermal engineering early in development, Broadcom and…
