TL;DR: Intel’s 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA technology, and improved chip densities, it promises…
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https://www.tweaktown.com/news/103427/intel-18a-process-is-finally-ready-with-chips-to-tape-out-in-1h-2025-battle-tsmc/index.html
