IBM partners with Siemens to advance nanostack transistor architecture

Key points:

• IBM in collaboration with Siemens has announced new research aimed at advancing IBM’s nanostack architecture, which was unveiled earlier this year.
• The collaboration will bring together IBM’s leadership in semiconductor device innovation and Siemens’ expertise in electronic design automation (EDA), process simulation, lithography optimization, and advanced manufacturing software to accelerate the development of nanostack.
• Through this collaboration, IBM and Siemens will work to advance the design, simulation, and lithography techniques needed for this and future nanostack generations beyond the current 7 angstrom node. The collaboration includes developing advanced virtual models of nanostack to model performance, optimize designs, and address fabrication challenges before chips are built.
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• Source: Press Release