IBM (NYSE: IBM) and University of Dayton to Build $10M+ AI Chip Nanofab, Opening 2027

New semiconductor nanofabrication facility will support advanced research and workforce development opportunities

YORKTOWN HEIGHTS, N.Y. and DAYTON, Ohio, Nov. 19, 2025 /PRNewswire/ — IBM (NYSE: IBM) and the University of Dayton today announced an agreement for the joint research and development of next-generation semiconductor technologies and materials. The collaboration aims to advance critical technologies for the age of AI including AI hardware, advanced packaging, and photonics.

To support the collaboration, IBM will contribute state-of-the-art semiconductor equipment to the University of Dayton for a new semiconductor nanofabrication facility on the university’s campus. With a planned completion in early 2027, the facility will serve as…