IBM joins project to develop 3D chip-to-chip and intra-chip photonic interconnects to speed data throughput

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IBM joins project to develop 3D chip-to-chip and intra-chip photonic interconnects to speed data throughput

ARLINGTON, Va. – Photonics and integrated circuits specialists from International Business Machines (IBM) Corp. in Armonk, N.Y., will help develop 3D chip-to-chip and intra-chip photonic interconnects to speed military information throughput…

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https://www.militaryaerospace.com/computers/article/55284057/ibm-chip-to-chip-photonic-interconnects-speed-data-throughput

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