By Lam Research Corp.
Publication Date: 2026-03-11 02:40:00
IBM and Lam Research Corp. have signed a new five-year agreement aimed at advancing logic semiconductor manufacturing to the sub-1nm node.
The two companies have collaborated for more than a decade on logic fabrication technologies, contributing to early generations of 7nm, nanosheet, and extreme ultraviolet (EUV) process technologies. The new agreement extends that partnership with a focus on materials development, advanced etch and deposition processes, and High Numerical Aperture (High-NA) EUV lithography.
The joint effort will target the development of new materials and process capabilities required for increasingly complex device architectures. It will also address High-NA EUV lithography processes designed to support next-generation interconnect and device patterning and accelerate broader industry adoption.
“Lam has been a critical partner to IBM for over a decade, contributing to key breakthroughs in logic scaling and…
