IBM and Lam Research Announce Collaboration to Advance Sub-1nm Logic Scaling – HPCwire

ALBANY, N.Y. and FREMONT, Calif., March 10, 2026 — IBM and Lam Research Corp. today announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High-NA EUV lithography processes to advance IBM’s logic scaling roadmap.

IBM and Lam have collaborated for more than a decade to advance logic fabrication, notably enabling early generations of 7nm, nanosheet, and EUV process technologies. Under this new five-year agreement, the companies intend to extend logic scaling to the sub-1nm node. The work will focus on developing new…