By Rajesh Pandey
Publication Date: 2026-05-04 13:36:00
There have been several Pixel 11 leaks so far, with some revealing its design and others sharing tidbits about its specs and supposed internal hardware changes. A new leak now provides more details about the Pixel 11’s hardware upgrades, including new camera sensors.
MysticLeaks, who recently teased the Pixel 11’s Tensor G6 CPU and GPU details, shared more information about the internals of the upcoming Pixel phones on his Telegram channel.
TSMC will supposedly fabricate the Pixel 11’s Tensor G6 chip on its N2 (2nm) node. The SoC will pack a 7-core CPU featuring 1x ARM C1-Ultra chip running at 4.11GHz, 4x ARM C1 Pro clocked at 3.38GHz, and 2x C1-Pro running at 2.65GHz for low-power tasks. A PowerVR CXTP-48 GPU will handle the graphics, with a new TPU and Titan M3 chip handling the AI and security tasks, respectively.
As previously rumored, Google also plans to use MediaTek’s newest M90 modem on the Tensor G6, replacing the power-hungry Exynos modem found in current…
