By Simply Wall St
Publication Date: 2026-03-10 00:24:00
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Broadcom (NasdaqGS:AVGO) has begun shipping industry first 2nm custom compute SoCs on its 3.5D XDSiP platform.
The modular XDSiP packaging is designed to support high signal density and efficiency for gigawatt scale AI clusters.
The company has outlined a roadmap for stacked and 3D chip designs, with multiple new stacking based products planned through 2027.
Broadcom, through its custom compute and networking business, is positioning itself at the center of AI infrastructure build outs with this 2nm SoC shipment. The XDSiP platform targets customers that need high performance, power efficient silicon to run large AI workloads across data centers. For investors watching the build out of AI clusters, the focus is on how packaging and compute advances like this shape long term hardware demand.
The new 2nm SoCs and the extended 3D stacking roadmap…
