Broadcom to Showcase AI Networking and Co-Packaged Optics at OCP Summit

Broadcom to Showcase AI Networking and Co-Packaged Optics at OCP Summit

By Andrew Jolly
Publication Date: 2026-10-08 19:54:00

PALO ALTO, Calif., Oct. 8, 2026 — Broadcom Inc., a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced it is set to present its latest innovations in scale-up, scale-out, and scale-across AI networking at the 2026 Open Compute Project (OCP) Global Summit. Running from October 12–15 in San […]