Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026

Spotlighting end-to-end AI infrastructure portfolio for gigawatt-scale clusters – spanning XPU, Ethernet, Optics, SerDes, DSP, and PCIe solutions

PALO ALTO, Calif., March 12, 2026 (GLOBE NEWSWIRE) — Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the 2026 Optical Fiber Communications Conference and Exhibition (OFC) from March 15-19 in Los Angeles. Broadcom’s demonstrations and presentations will highlight its end-to-end connectivity solutions paving the path for the 200T AI era.