By Broadcom Inc.
Publication Date: 2026-10-08 16:00:00
Company to Highlight OCP Rack-Based Innovations Enabling Scale-Up, Scale-Out, and Scale-Across Networks Across AI Clusters
PALO ALTO, Calif., Oct. 08, 2026 (GLOBE NEWSWIRE) — Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced it is set to present its latest innovations in scale-up, scale-out, and scale-across AI networking at the 2026 Open Compute Project (OCP) Global Summit. Running from October 12–15 in San Jose, Broadcom will feature Ethernet switches, NICs, PCIe components and integrated optics to power Open Rack Version 3 (ORV3) solutions for scaling AI infrastructure.
Featured innovations include Tomahawk® 6, Tomahawk Ultra, and Jericho 4 Ethernet switches, the Thor Ultra 800G and Thor 2 400G AI Ethernet NICs, and Broadcom’s third-generation TH6-Davisson Co-Packaged Optics (CPO) — a portfolio built to meet…
