By Applied Materials, Inc.
Publication Date: 2026-05-20 12:00:00
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Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems
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Partnership will leverage Applied’s global network of innovation centers, including new EPIC Center in Silicon Valley
SANTA CLARA, Calif., May 20, 2026 (GLOBE NEWSWIRE) — Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced that Broadcom Inc. (Nasdaq: AVGO) will join Applied’s EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems.
The explosive growth of AI has driven a surge in demand for high-performance, energy-efficient compute infrastructure. To address this demand, chipmakers and system designers are increasingly adopting advanced packaging techniques and heterogeneous integration of multiple chips, aiming to boost energy-efficient…
