By Siu Han, Taipei
Publication Date: 2026-08-27 02:21:00
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most of the planned capacity has already been booked, as the Taiwan-based OSAT supplier builds a second growth engine around advanced packaging and optical integration.
