By Lee Wade
Publication Date: 2025-11-20 05:44:00
The University of Dayton and technology company IBM announced a new research collaboration on Wednesday afternoon. The partnership will be focused on developing next-generation semiconductor technologies, including advanced AI hardware, packaging, and photonics.
The partnership was announced at an event on UD’s campus and could represent more than $20 million in combined investment between the university and IBM over a decade of collaboration, officials said.
They said the collaboration addresses critical workforce and innovation needs in advanced chip manufacturing. As a part of the partnership, the University of Dayton is launching a co-major in semiconductor manufacturing engineering, the university said, to help train the next generation of engineers and technical professionals.
“Look out, world, IBM and UD are working together,” said University of Dayton President Eric F. Spina during the event.
UD and IBM said the partnership centers on…
