Intel’s EMIB packaging technology is being increasingly adopted by Intel Foundry customers, with support from third-party EDA tools. Companies like Ansys, Cadence, Siemens, and Synopsys now offer software that supports EMIB chiplet-to-chiplet interconnects for AI and HPC processors.
EMIB technology allows for the integration of multi-chip designs into a single package using a silicon bridge to connect the chiplets. Various design tools, methodologies, and IP blocks from Ansys, Cadence, Siemens, and Synopsys are now qualified to assist customers using EMIB packaging technology.
Ansys has collaborated with Intel Foundry to verify and test EMIB technology on Intel 18A process nodes and heterogeneous packaging platforms. Cadence has developed a comprehensive 2.5D EMIB packaging stream and offers design IP for 18A, simplifying the development of chiplets and multi-die systems. Siemens has introduced an EMIB reference flow and certification for its Solido Simulation Suite on Intel nodes, expanding design and verification tools available to customers.
Synopsys provides an AI-powered multi-chipset reference stream for EMIB technology, along with the Synopsys 3DIC compiler for design optimization. This collaboration aims to accelerate the exploration and development of multi-die designs, improving system performance and productivity.
Intel Foundry’s vice president of Ecosystem Development, Suk Lee, emphasizes the importance of collaboration with the ecosystem to help customers achieve their AI system goals. By leveraging a comprehensive ecosystem of design tools and third-party IPs, Intel Foundry aims to support innovation across the technology stack.
In conclusion, Intel’s EMIB packaging technology is gaining traction among Intel Foundry customers, supported by a range of EDA tools from companies like Ansys, Cadence, Siemens, and Synopsys. This collaboration aims to facilitate the development of AI and HPC processors and accelerate the adoption of EMIB technology for multi-chip designs. Intel Foundry’s commitment to providing a comprehensive set of design tools and support will enable customers to embrace IF and EMIB manufacturing technologies for their projects.
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https://www.tomshardware.com/tech-industry/intels-emib-packaging-tech-is-now-supported-by-industry-standard-design-and-test-tools
