Google has released two new models in its Gemma Series 2: The 27B and the 9B. The 27B model boasts 27 billion parameters and excels in handling complex tasks with precision and depth in language comprehension. On the other hand, the 9B model offers a lightweight option with 9 billion parameters, suitable for applications requiring … Read more
Intel Corporation’s Integrated Photonics Solutions (IPS) Group has made a significant breakthrough in integrated photonics technology by introducing the industry’s first fully integrated optical computing interconnect (OCI) chiplet. This revolutionary chiplet, showcased at the 2024 Optical Fiber Communications Conference, is designed to enhance high-speed data transmission in AI infrastructure for data centers and high-performance computing … Read more
Oracle has launched HeatWave GenAI, a new offering that includes various advanced features such as large in-database language models, automated vector warehousing, scalable vector processing, and contextually informed natural language conversations for unstructured content. This allows companies to utilize generative AI capabilities for their data without the need for AI expertise or transferring data to … Read more
AI assistants that combine generative AI with automation are driving productivity in organizations as they integrate AI into their operations. These assistants help transform work processes by automating repetitive tasks, enabling self-service actions, and providing guidance for end-to-end processes. IBM is leading the way in enterprise adoption of AI with the introduction of several innovations … Read more
Intel has successfully showcased an optical chiplet integrated with a CPU that can support 4 Tbps data links to cater to the escalating bandwidth needs of AI and high-performance computing applications in data centers. This optical computational interconnect (OCI) chiplet prototype is a significant advancement in high-bandwidth interconnect technology, building on Intel’s longstanding support for … Read more
Intel has showcased its groundbreaking innovation through the demonstration of the first fully integrated optical I/O chiplet. This technology combines optical and electronic components on a single chip, enabling faster and more energy-efficient data transfer in computing systems. The optical I/O chiplet was displayed by Intel at the Integrated Photonics Systems Roadmap conference. This cutting-edge … Read more
AAEON PICO-RAP4, a subsidiary of ASUS, has introduced Pico-ITX single-board computers that are powered by Intel Raptor Lake processors. This new line of computers is designed for embedded systems and features compact and efficient performance. The processors used in these computers are known for high performance and power efficiency. The AAEON PICO-RAP4 computers are equipped … Read more
AMD’s GPUOpen team is set to present their new paper on “Neural Texture Block Compression” at the EGSR conference on July 2, following in the footsteps of Nvidia’s neural texture compression research. The paper will focus on using a small neural network to compress textures, reducing data size and saving storage space for video game … Read more
A new set of benchmarks for the Intel Core Ultra 200V “Lunar Lake” CPU has been leaked, focusing on performance and power characteristics of the chip. The benchmarks reveal that the Lunar Lake CPUs have a similar compute tile configuration with four P-Cores based on the Lion Cove core architecture and four LP-E cores based … Read more
ePlus Inc., a provider of technology solutions for business outcomes, has introduced a new disaster recovery service named Azure Recover. This service, fully managed and powered by Azure Site Recovery, is designed to protect workloads on-premises, in Azure, or other cloud environments. It offers features like automated testing, support during failover events, and recovery validation … Read more