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Intel

ASML’s Hyper-NA EUV Price Doubling Rumors Lead TSMC, Samsung, and Intel to Hesitate – TrendForce

vm_admin - July 3, 2024

A rumor has been circulating that the price of ASML's Hyper-NA EUV technology is set to double, causing major tech companies like TSMC,...

Broadcom

Broadcom Reportedly Collaborating with ByteDance to Develop 5nm AI Chip, to be Manufactured by TSMC | TrendForce Insights

vm_admin - June 28, 2024

ByteDance, the parent company of TikTok, is reportedly teaming up with American chip designer Broadcom to develop an advanced AI processor. This...

Intel

[News] TSMC, Samsung, and Intel Enter New Battleground in Panel-Level Packaging | TrendForce Insights

vm_admin - June 25, 2024

The semiconductor industry is witnessing a shift towards panel-level packaging, with TSMC, Intel, and Samsung investing in this technology. TSMC, a prominent wafer...

Intel

[Intel Announces High-volume Production of Datacenter-Oriented 3nm Chips | TrendForce Insights]

vm_admin - June 20, 2024

Intel has announced the commencement of high-volume production of its 3nm technology at its factories in Oregon and Ireland. The focus of this...

Intel

Intel’s Lunar Lake Memory Bundle Sparks Controversy in PC Supply Chain, According to TrendForce Insights

vm_admin - May 22, 2024

Intel has announced that its next-generation processor, Lunar Lake, will be released earlier than expected, with the official shipments scheduled for the third quarter....

Intel

Intel to Embrace New High-NA EUV Technology, Potential Increase in Costs and Losses Predicted – TrendForce Analysis

vm_admin - May 21, 2024

Intel's decision to adopt ASML's high numerical aperture extreme ultraviolet (High-NA EUV) lithography equipment is seen as a strategic move to regain its technological...

Tag: TrendForce

ASML’s Hyper-NA EUV Price Doubling Rumors Lead TSMC, Samsung, and Intel to Hesitate – TrendForce

Broadcom Reportedly Collaborating with ByteDance to Develop 5nm AI Chip, to be Manufactured by TSMC | TrendForce Insights

[News] TSMC, Samsung, and Intel Enter New Battleground in Panel-Level Packaging | TrendForce Insights

[Intel Announces High-volume Production of Datacenter-Oriented 3nm Chips | TrendForce Insights]

Intel’s Lunar Lake Memory Bundle Sparks Controversy in PC Supply Chain, According to TrendForce Insights

Intel to Embrace New High-NA EUV Technology, Potential Increase in Costs and Losses Predicted – TrendForce Analysis

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