Synopsys has introduced a reference flow that offers a holistic co-design and analysis solution using their 3DIC compiler to aid in the development of multi-die designs. This solution is designed to speed up the process of exploring and creating multi-die designs from silicon to system stages. By integrating 3DSO.ai with the 3DIC compiler, Synopsys aims … Read more
Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for multi-die integration. This technology allows for the seamless integration of multiple chips on a single package, enabling more efficient and powerful semiconductor designs. The EMIB reference flow from Synopsys and Intel Foundry aims to streamline … Read more
Intel Foundry has recently announced partnerships with Cadence Design Systems, Ansys, and Synopsys to collaborate on advanced chip design and development. This move signals Intel’s commitment to expanding its capabilities in the semiconductor market and strengthening its position as a leading provider of chip manufacturing services. The collaboration with Cadence Design Systems, Ansys, and Synopsys … Read more
Synopsys has announced the availability of its multi-die reference flow for Intel Foundry’s EMIB packaging technology. This flow, powered by Synopsys.ai EDA Package and Synopsys IP, enables a unified co-design and analysis solution for multi-die designs. The 3DIC compiler from Synopsys supports efficient inter-die connectivity and high memory bandwidth requirements. This collaboration aims to accelerate … Read more
Today’s vehicles are increasingly reliant on software and semiconductors, making the risk of failure higher, but automakers can mitigate these risks through collaboration. Synopsys and Amazon Web Services (AWS) are working together to improve automotive systems and systems-on-chip (SoC) for software-defined vehicles (SDVs). Their solutions, including Silicon Lifecycle Management (SLM) and virtual prototypes, run on … Read more