Researchers utilize Nvidia Omniverse for analyzing and enhancing stacked chip designs in 3D.
Semiconductor chip construction is evolving with the adoption of new 3D stacking technologies that enhance chip density beyond traditional methods. Nvidia’s collaboration with Ansys in using the Omniverse platform for analyzing 3D semiconductor designs offers major advantages for chip designers. By utilizing Nvidia’s Fourier module neural operator architecture, Ansys can predict power profiles and simulate … Read more