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Intel

Intel Foundry ecosystem partners incorporate reference flows for advanced packaging technology EMIB

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Intel's foundry ecosystem partners have recently introduced reference flows for advanced EMIB (Embedded Multi-die Interconnect Bridge) packaging. This technology allows for the integration...
Intel

Synopsys Introduces Ready-to-Use Multi-Die Reference Flow for Intel Foundry in New Electronics

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Synopsys has introduced a reference flow that offers a holistic co-design and analysis solution using their 3DIC compiler to aid in the development...
Intel

Synopsys Introduces Intel Foundry EMIB Reference Flow for Multi-die Systems – Embedded Applications

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Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for multi-die integration. This...
Intel

Synopsys Expedites Chip Innovation with Fully-Prepared Multi-Die Reference Flow for Intel Foundry

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Synopsys has announced the availability of its multi-die reference flow for Intel Foundry's EMIB packaging technology. This flow, powered by Synopsys.ai EDA Package...
Nvidia

Hyve AmpereOne NVIDIA Micro-MGX Reference Platform Revealed

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The Ampere AmpereOne platform by Hyve was showcased at GTC 2024, featuring a modular NVIDIA Micro-MGX reference platform. The server chassis includes an 8x...

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