Rapidus

Rapidus and IBM Strengthen Partnership in Chiplet Packaging Technology for 2nm-Generation Semiconductors

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Rapidus and IBM Strengthen Partnership in Chiplet Packaging Technology for 2nm-Generation Semiconductors

Rapidus Corporation, a manufacturer of advanced logic semiconductors, and IBM have announced a joint development partnership to work on chiplet packages. This collaboration aims to establish mass production technologies for chiplet packages, with Rapidus receiving IBM packaging technology for high-performance semiconductors. The two companies will work together to innovate in this space, continuing their existing … Read more

IBM partners with Rapidus to enhance chiplet packaging

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IBM partners with Rapidus to enhance chiplet packaging

Tech giant IBM and Japanese semiconductor manufacturer Rapidus have joined forces to advance mass production technologies for chiplet packages. This collaboration focuses on the development of 2nm generation semiconductors as part of the Japan New Energy and Industrial Technology Development Organization’s project. Rapidus will leverage IBM’s packaging technology to enhance high-performance semiconductors. The partnership will … Read more

Rapidus partners with IBM to collaborate on chiplet packaging

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Rapidus partners with IBM to collaborate on chiplet packaging

Rapidus has partnered with IBM to utilize their packaging technology for high-performance semiconductors. The collaboration aims to facilitate further innovation in the semiconductor industry. Rapidus CEO Atsuyoshi Koike expressed enthusiasm about the international partnership and highlighted the potential for Japan to enhance its presence in the semiconductor packaging supply chain. This collaboration is part of … Read more

Rapidus broadens partnership with IBM to include chiplet packaging

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Rapidus broadens partnership with IBM to include chiplet packaging

Rapidus has recently expanded its partnership with IBM to include chiplet packaging, as reported by eeNews Europe. This agreement will enhance their efforts in developing advanced packaging solutions for a wide range of applications. Rapidus will leverage IBM’s expertise in chiplet technology to further improve the performance and efficiency of their products. This collaboration signifies … Read more

Rapidus and IBM strengthen partnership in chiplet packaging technology – TipRanks.com

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Rapidus and IBM strengthen partnership in chiplet packaging technology – TipRanks.com

IBM and Fast have recently announced a partnership to jointly develop cutting-edge chiplet packages. This collaboration aims to establish mass production technologies for high-performance semiconductors, with Rapidus benefiting from IBM’s advanced packaging technology. The two companies will work together to drive innovation in this area. The agreement is part of a larger international project led … Read more