Rapidus and IBM Strengthen Partnership in Chiplet Packaging Technology for 2nm-Generation Semiconductors
Rapidus Corporation, a manufacturer of advanced logic semiconductors, and IBM have announced a joint development partnership to work on chiplet…
Tag: Rapidus
IBM partners with Rapidus to enhance chiplet packaging
Tech giant IBM and Japanese semiconductor manufacturer Rapidus have joined forces to advance mass production technologies for chiplet packages. This…
Rapidus partners with IBM to collaborate on chiplet packaging
Rapidus has partnered with IBM to utilize their packaging technology for high-performance semiconductors. The collaboration aims to facilitate further innovation…
Rapidus broadens partnership with IBM to include chiplet packaging
Rapidus has recently expanded its partnership with IBM to include chiplet packaging, as reported by eeNews Europe. This agreement will…
Rapidus and IBM strengthen partnership in chiplet packaging technology – TipRanks.com
IBM and Fast have recently announced a partnership to jointly develop cutting-edge chiplet packages. This collaboration aims to establish mass…