Japan chipmaker Rapidus tops $1bn in private investment as IBM aims to join
By Staff Writer Publication Date: 2026-02-04 14:23:00 SoftBank, Sony set to become major shareholders with commitments exceeding target
Tag: Rapidus
IBM CEO sounds alarm on chip supply risk; backs Rapidus as strategic counterweight
IBM CEO Arvind Krishna. Credit: AFP As the semiconductor industry shifts toward geographic diversification and manufacturing resilience, IBM CEO Arvind…
Rapidus’ chip plans are ‘good for world,’ IBM CEO says
Rapidus’ chip plans are ‘good for world,’ IBM CEO says Nikkei Asia Article Source https://asia.nikkei.com/Business/Tech/Semiconductors/Rapidus-chip-plans-are-good-for-world-IBM-CEO-says
With IBM’s help, Rapidus seeks to cash in on U.S. supply chain push
TOKYO — Japanese chipmaker Rapidus began test production at its Hokkaido plant Tuesday, a milestone reached with technological support from…
TSMC takes over Intel foundry? Samsung and Rapidus face steep headwinds
TSMC takes over Intel foundry? Samsung and Rapidus face steep headwinds DIGITIMES Article Source https://www.digitimes.com/news/a20250219PD203/tsmc-intel-samsung-rapidus-market.html
Rapidus plans to send 2nm chips to Broadcom in June, says report
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![[News] Foundry Giants’ Advanced Node Expansion Efforts Beyond 2025: TSMC, Intel, Rapidus and More | TrendForce News](https://i1.wp.com/img.trendforce.com/blog/wp-content/uploads/2025/01/10152150/Intel-Ohio-624x351.jpg?resize=624,351&ssl=1 "[News] Foundry Giants’ Advanced Node Expansion Efforts Beyond 2025: TSMC, Intel, Rapidus and More | TrendForce News")
[News] Foundry Giants’ Advanced Node Expansion Efforts Beyond 2025: TSMC, Intel, Rapidus and More | TrendForce News
Foundry giants, as well as ambitious newcomers, have been making strides in capacity expansion as soon as 2025 kicks start.…
Rapidus and IBM Strengthen Partnership in Chiplet Packaging Technology for 2nm-Generation Semiconductors
Rapidus Corporation, a manufacturer of advanced logic semiconductors, and IBM have announced a joint development partnership to work on chiplet…
IBM partners with Rapidus to enhance chiplet packaging
Tech giant IBM and Japanese semiconductor manufacturer Rapidus have joined forces to advance mass production technologies for chiplet packages. This…
Rapidus partners with IBM to collaborate on chiplet packaging
Rapidus has partnered with IBM to utilize their packaging technology for high-performance semiconductors. The collaboration aims to facilitate further innovation…