Kyndryl showers execs with shares while staff ponder redundancy packages
By Paul Kunert Publication Date: 2026-06-09 10:45:00 On-prem IBM spin-off’s top brass bag six-figure stock awards Timing, as we noted…
Tag: packages
For the 2nd time in weeks, Microsoft packages laced with credential stealer
By Dan Goodin Publication Date: 2026-06-08 18:34:00 Dozens of cryptographically verified open source packages from Microsoft were compromised late last…
Typosquatted npm packages used to steal cloud and CI/CD secrets | Microsoft Security Blog
By Microsoft Defender Security Research Team Publication Date: 2026-05-29 03:04:00 In this article Microsoft has identified an active supply chain…
PCI PIN and P2PE compliance packages for AWS Payment Cryptography are now available | Amazon Web Services
Amazon Web Services (AWS) is pleased to announce the successful completion of Payment Card Industry Personal Identification Number (PCI PIN)…
Arch Linux’s Main NVIDIA Driver Packages Now Using The Open Kernel Modules
By @michaellarabel Publication Date: With the Arch Linux packages for the NVIDIA official graphics driver moving to the now-stable NVIDIA…
Not Meta-like $100 million pay packages: The ‘biggest’ reason why Google’s ex-employees are returning to company – The Times of India
By TOI Tech Desk Publication Date: 2025-12-20 13:31:00 As the Silicon Valley ‘AI talent war’ escalates into a multi-billion dollar…
Microsoft AI CEO Mustafa Suleyman says he won’t match Meta’s high-flying pay packages
By Lakshmi Varanasi Publication Date: 2025-12-13 23:36:00 The talent wars continue to rage across Silicon Valley as companies vie for…
Amazon Inspector detects over 150,000 malicious packages linked to token farming campaign | Amazon Web Services
Amazon Inspector security researchers have identified and reported over 150,000 packages linked to a coordinated tea.xyz token farming campaign in…
HPE offerings dive into AI features and new bundle packages | TechTarget
AI agents are now swimming throughout Hewlett Packard Enterprises’ GreenLake cloud and its associated software, bringing copilot interactions and…
Floorplanning Method Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
A new technical paper titled “STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers…