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Intel

Synopsys Introduces Ready-to-Use Multi-Die Reference Flow for Intel Foundry in New Electronics

vm_admin - June 25, 2024

Synopsys has introduced a reference flow that offers a holistic co-design and analysis solution using their 3DIC compiler to aid in the development...

Intel

Synopsys Introduces Intel Foundry EMIB Reference Flow for Multi-die Systems – Embedded Applications

vm_admin - June 24, 2024

Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for multi-die integration. This...

Intel

Synopsys Expedites Chip Innovation with Fully-Prepared Multi-Die Reference Flow for Intel Foundry

vm_admin - June 24, 2024

Synopsys has announced the availability of its multi-die reference flow for Intel Foundry's EMIB packaging technology. This flow, powered by Synopsys.ai EDA Package...

Tag: MultiDie

Synopsys Introduces Ready-to-Use Multi-Die Reference Flow for Intel Foundry in New Electronics

Synopsys Introduces Intel Foundry EMIB Reference Flow for Multi-die Systems – Embedded Applications

Synopsys Expedites Chip Innovation with Fully-Prepared Multi-Die Reference Flow for Intel Foundry

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