Synopsys has introduced a reference flow that offers a holistic co-design and analysis solution using their 3DIC compiler to aid in the development of multi-die designs. This solution is designed to speed up the process of exploring and creating multi-die designs from silicon to system stages. By integrating 3DSO.ai with the 3DIC compiler, Synopsys aims … Read more
Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for multi-die integration. This technology allows for the seamless integration of multiple chips on a single package, enabling more efficient and powerful semiconductor designs. The EMIB reference flow from Synopsys and Intel Foundry aims to streamline … Read more
Synopsys has announced the availability of its multi-die reference flow for Intel Foundry’s EMIB packaging technology. This flow, powered by Synopsys.ai EDA Package and Synopsys IP, enables a unified co-design and analysis solution for multi-die designs. The 3DIC compiler from Synopsys supports efficient inter-die connectivity and high memory bandwidth requirements. This collaboration aims to accelerate … Read more