Scaling Optical Interconnects with Co-Packaged Optics (CPO) in Margalit’s Vicinity

Scaling Optical Interconnects with Co-Packaged Optics (CPO) in Margalit’s Vicinity

Margalit is a leading expert in the field of optical interconnect technology, specifically focusing on the scaling of optical interconnects using co-packaged optics (CPO). CPO is a cutting-edge technology that involves integrating optical components directly into the package of a chip, allowing for high-speed and energy-efficient data transfer within data centers and other high-performance computing … Read more

Intel reveals new chiplet for optical computing interconnects enabling data transmission over 100 times further using light

Intel reveals new chiplet for optical computing interconnects enabling data transmission over 100 times further using light

Intel has unveiled a groundbreaking technology known as Optical Compute Interconnect (OCI), which integrates optical input/output chiplets with a CPU. This innovation allows for data transmission over longer distances with high bandwidth and low power consumption compared to traditional chips that use copper wires and electricity for data exchange. The OCI technology is expected to … Read more