The industry-standard design and test tools now support Intel’s EMIB packaging tech
Intel’s EMIB packaging technology is being increasingly adopted by Intel Foundry customers, with support from third-party EDA tools. Companies like Ansys, Cadence, Siemens, and Synopsys now offer software that supports EMIB chiplet-to-chiplet interconnects for AI and HPC processors. EMIB technology allows for the integration of multi-chip designs into a single package using a silicon bridge … Read more